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United States Patent and Trademark Office 



UNITED STATES DEPARTMENT OF COMMERCE 
United States Patent and Trademark Office 
Address: COMMISSIONER FOR PATENTS 
P.O. Box 1450 

Alexandria, Virginia 22313-1450 
www.uspto.gov 



| ATTORNEY DOCKET NO. | CONFIRMATION NO. 



APPLICATION NO. 



FILING DATE 



FIRST NAMED INVENTOR 



10/762,451 



01/23/2004 



Hidenori Hasegawa 



2004-0096A 



5478 



513 7590 03/20/2006 

WENDEROTH, LIND & PONACK, L.L.P. 
2033 K STREET N. W. 
SUITE 800 

WASHINGTON, DC 20006-1021 



EXAMINER 



TOLEDO, FERNANDO L 



ART UNIT 



PAPER NUMBER 



2823 

DATE MAILED: 03/20/2006 



Please find below and/or attached an Office communication concerning this application or proceeding. 



PTO-90C (Rev. 10/03) 



D/fir^P Antinn Summary/ 


Application No. 

10/762,451 


Applicant(s) 

HASEGAWA, HIDENORI 


Examiner 

Fernando L Toledo 


Art Unit 

2823 





-- The MAILING DATE of this communication appears on the cover sheet with the correspondence address - 
Period for Reply 



A SHORTENED STATUTORY PERIOD FOR REPLY IS SET TO EXPIRE 3 MONTH(S) OR THIRTY (30) DAYS, 
WHICHEVER IS LONGER, FROM THE MAILING DATE OF THIS COMMUNICATION. 

- Extensions of time may be available under the provisions of 37 CFR 1 .136(a). In no event, however, may a reply be timely filed 
after SIX (6) MONTHS from the mailing date of this communication. 

- If NO period for reply is specified above, the maximum statutory period will apply and will expire SIX (6) MONTHS from the mailing date of this communication. 

- Failure to reply within the set or extended period for reply will, by statute, cause the application to become ABANDONED (35 U.S.C. § 133). 
Any reply received by the Office later than three months after the mailing date of this communication, even if timely filed, may reduce any 
earned patent term adjustment. See 37 CFR 1.704(b). 

Status 

1)^ Responsive to communication(s) filed on 23 December 2005 . 
2a)M This action is FINAL. 2b)D This action is non-final. 

3) D Since this application is in condition for allowance except for formal matters, prosecution as to the merits is 

closed in accordance with the practice under Ex parte Quay/e, 1935 CD. 11, 453 O.G. 213. 

Disposition of Claims 

4) I3 Claim(s) 8-77 is/are pending in the application. 

4a) Of the above claim(s) is/are withdrawn from consideration. 

5) D Claim(s) is/are allowed. 

6) M Claim(s) 8-17 is/are rejected. 

7) D Claim(s) is/are objected to. 

8) D Claim(s) are subject to restriction and/or election requirement. 

Application Papers 

9) D The specification is objected to by the Examiner. 

10) D The drawing(s) filed on is/are: a)D accepted or b)D objected to by the Examiner. 

Applicant may not request that any objection to the drawing(s) be held in abeyance. See 37 CFR 1 .85(a). 
Replacement drawing sheet(s) including the correction is required if the drawing(s) is objected to. See 37 CFR 1.121(d). 

11) D The oath or declaration is objected to by the Examiner. Note the attached Office Action or form PTO-152. 

Priority under 35 U.S.C. § 119 

12) 13 Acknowledgment is made of a claim for foreign priority under 35 U.S.C. § 1 1 9(a)-(d) or (f). 
a® All b)D Some * c)D None of: 

1 M Certified copies of the priority documents have been received. 

2. Q Certified copies of the priority documents have been received in Application No. . 

3. D Copies of the certified copies of the priority documents have been received in this National Stage 

application from the International Bureau (PCT Rule 17.2(a)). 
* See the attached detailed Office action for a list of the certified copies not received. 



Attachment(s) 

1 ) □ Notice of References Cited (PTO-892) 

2) CH Notice of Draftsperson's Patent Drawing Review (PTO-948) 

3) S Information Disclosure Statement(s) (PTO-1449 or PTO/SB/08) 

Paper No(s)/Mail Date 20060203 . 



4) 0 Interview Summary (PTO-413) 

Paper No(s)/Mail Date. . 

5) □ Notice of Informal Patent Application (PTO-152) 

6) □ Other: . 



U.S. Patent and Trademark Office 

PTOL-326 (Rev. 7-05) 



Office Action Summary 



Part of Paper No./Mail Date 20060313 



V 



Application/Control Number: 1 0/762,45 1 
Art Unit: 2823 



DETAILED ACTION 



Claim Rejections - 35 USC §102 

1. The following is a quotation of the appropriate paragraphs of 35 U.S. C. 102 that form the 
basis for the rejections under this section made in this Office action: 

A person shall be entitled to a patent unless - 

(e) the invention was described in (1) an application for patent, published under section 122(b), by another filed 
in the United States before the invention by the applicant for patent or (2) a patent granted on an application for 
patent by another filed in the United States before the invention by the applicant for patent, except that an 
international application filed under the treaty defined in section 35 1(a) shall have the effects for purposes of this 
subsection of an application filed in the United States only if the international application designated the United 
States and was published under Article 21(2) of such treaty in the English language. 

2. Claims 8 - 17 are rejected under 35 U.S.C. 102(e) as being anticipated by Minamio et al. 
(US Patent Application Publication US 2003/0015775 Al). 

3. In re claims 8, 11 and 14, Minamio, in the US Patent Application Publication US 
2003/0015775 Al; figures 1A - 10D discloses arranging several of linear leadframes (1 and 4) 
side by side separately from each other (Figure IB); mounting several semiconductor chips 3 
having a first main surface with several of electrode pads on a second main surface facing the 
main surface, each of the semiconductor chips placed over the several of the linear leadframes 
and separated from each other in a direction extending the linear leadframes with the second 
main surface of the semiconductor chip thereon (Figure 6B); joining several of the electrode pads 
to the several of the linear leadframes with bonding wires 5 (Figure 6C); forming the 
encapsulation part 6 for encapsulating the semiconductor chip and the bonding wire and an 
interframe encapsulation part for burying a space between the adjacent linear leadframes exposed 
outside the encapsulation part (Figure 6D); forming a groove part for cutting all the linear 
leadframes places under the second main surface in a vertical direction to the direction extending 



Application/Control Number: 1 0/762,45 1 Page 3 

Art Unit: 2823 

the linear leadframes (Figures 6 A - 1)\ and cutting the leadframes and the inter frame 
encapsulation parts exposed between the several of the semiconductor chips to separate into a 
semiconductor device having the semiconductor chip, a first external terminal row and second 
external terminal row facing each other as sandwich the groove part (Figure 7). 

4. In re claims 9 and 12 Minamio discloses wherein the mounting is conducted by exposing 
outermost leadframes on both sides among the several of the linear leadframes arranged side by 
side, and the joining does not join the bonding wires to the outermost leadframes (Figure 6B). 

5. In re claims 10, 13 and 17, Minamio, discloses wherein the mounting comprises 
mounting the semiconductor chips directly on the leadframes so that the second main surface of 
each of the semiconductor chips is directly attached to the leadframes via adhesive fl| 0085). 

6. In re claim 15, Minamio discloses wherein the encapsulation part and the frame 
encapsulation part are formed in one piece (Figure 6D). 

7. In re claim 17, Minamio discloses wherein the several of the first external terminals are 
separated in stripes (Figure IB). 

Response to Arguments 

8. Applicant's arguments filed 23 December 2005 have been fully considered but they are 
not persuasive for the following reasons. 

9. Applicant contests that the die pad of Minamio is not a lead frame and that there are no 
electrode pads. Examiner respectfully submits that the die pad 1 of Minamio is part of the lead 
frame as evidenced in paragraph 0082 of Minamio, which states in part that that the lead frame 



Application/Control Number: 1 0/762,45 1 Page 4 

Art Unit: 2823 

unit 1 1 has outer lead frames 9 and 10 and die pad 1. Minamio also teaches in paragraph 0086. 
Hence the 35 USC 102(e) rejection stands and it is considered proper. 



Conclusion 

10. THIS ACTION IS MADE FINAL. Applicant is reminded of the extension of time 
policy as set forth in 37 CFR 1 .136(a). 

A shortened statutory period for reply to this final action is set to expire THREE 
MONTHS from the mailing date of this action. In the event a first reply is filed within TWO 
MONTHS of the mailing date of this final action and the advisory action is not mailed until after 
the end of the THREE-MONTH shortened statutory period, then the shortened statutory period 
will expire on the date the advisory action is mailed, and any extension fee pursuant to 37 
CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, 
however, will the statutory period for reply expire later than SIX MONTHS from the mailing 
date of this final action. 

Any inquiry concerning this communication or earlier communications from the 
examiner should be directed to Fernando L. Toledo whose telephone number is 571-272-1867. 
The examiner can normally be reached on Mon-Thu 7am to 5:30pm. 

If attempts to reach the examiner by telephone are unsuccessful, the examiner's 
supervisor, Matthew Smith can be reached on 571-272-1907. The fax phone number for the 
organization where this application or proceeding is assigned is 571-273-8300. 



k Application/Control Number: 1 0/762,45 1 Page 5 

Art Unit: 2823 

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may be obtained from either Private PAIR or Public PAIR. Status information for unpublished 
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system, contact the Electronic Business Center (EBC) at 866-217-9 



97 (toll-free). 




13 March 2006 



George' Fourson 
Primary Examiner 
Art Unit 2823